Conversely, sputtering is presented as a momentum-transfer process rather than a thermal one. By bombarding a target material with energetic ions (usually argon), atoms are ejected and deposited onto the substrate. Goswami highlights the advantage of sputtering for refractory metals and compounds, as it does not require the source material to melt or sublime. The text also introduces CVD, wherein a chemical reaction occurs at the substrate surface to form a solid film. This distinction is crucial, as CVD often yields higher adhesion and better step coverage compared to the line-of-sight deposition typical of PVD.
A. Goswami, “Thin Film Fundamentals,” New Age ... - Scirp.org. Thin Film Fundamentals A Goswami Pdf
"Thin Film Fundamentals" by A. Goswami is a comprehensive textbook covering the preparation, characterization, and physical properties of thin films for students and researchers in material science. The text bridges theory and practice, detailing methods like PVD and CVD alongside analysis techniques such as XRD and electron microscopy. Detailed insights into the book can be found through various academic and technical publications. The text also introduces CVD, wherein a chemical